November 2013 - Vol. 56 No. 11

November 2013 issue cover image

Features

Research and Advances Research highlights

Centip3De: A Many-Core Prototype Exploring 3D Integration and Near-Threshold Computing

This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias.

Recent Issues

  1. September 2025 cover
    September 2025 Vol. 68 No. 9
  2. August 2025 cover
    August 2025 Vol. 68 No. 8
  3. July 2025 cover
    July 2025 Vol. 68 No. 7
  4. June 2025 CACM cover
    June 2025 Vol. 68 No. 6