November 2013 - Vol. 56 No. 11

November 2013 issue cover image

Features

Research and Advances Research highlights

Centip3De: A Many-Core Prototype Exploring 3D Integration and Near-Threshold Computing

This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias.

Recent Issues

  1. October 2024 CACM cover
    October 2024 Vol. 67 No. 10
  2. September 2024 CACM cover
    September 2024 Vol. 67 No. 9
  3. August 2024 CACM cover
    August 2024 Vol. 67 No. 8
  4. July 2024 CACM cover
    July 2024 Vol. 67 No. 7