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From Communications of the ACM

Technical Perspective: A Gloomy Look at the Integrity of Hardware

"Exploiting the Analog Properties of Digital Circuits for Malicious Hardware," by Kaiyuan Yang, et al., assumes semiconductor foundries (and others in chip fabrication)...

Exploiting the Analog Properties of Digital Circuits for Malicious Hardware
From Communications of the ACM

Exploiting the Analog Properties of Digital Circuits for Malicious Hardware

We show how a fabrication-time attacker can leverage analog circuits to create a hardware attack that is small and stealthy.

From Communications of the ACM

Technical Perspective: Toward Reliable Programming for Unreliable Hardware

"Verifying Quantitative Reliability for Programs that Execute on Unreliable Hardware" by Carbin et al. addresses challenges related to a bug, how likely it is to...

From Communications of the ACM

Technical Perspective: Rethinking Caches for Throughput Processors

As GPUs have become mainstream parallel processing engines, many applications targeting GPUs now have data locality more amenable to traditional caching. The...

Learning Your Limit
From Communications of the ACM

Learning Your Limit: Managing Massively Multithreaded Caches Through Scheduling

This paper studies the effect of accelerating highly parallel workloads with significant locality on a massively multithreaded GPU.

From Communications of the ACM

Technical Perspective: Silicon Stress

Moore's Law has been the mainstay of semiconductor electronics since the invention of the transistor and its application to the integrated circuit. Implicit in...

TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3D IC
From Communications of the ACM

TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3D IC

Three-dimensional integrated circuit (3D IC) with through-silicon-via (TSV) is believed to offer new levels of efficiency, power, performance, and form-factor advantages...

From Communications of the ACM

Technical Perspective: The Cleanest Garbage Collection

In quite a tour de force, the authors of the following paper have built a provably correct real-time garbage collector for reconfigurable hardware (field programmable...

And Then There Were None
From Communications of the ACM

And Then There Were None: A Stall-Free Real-Time Garbage Collector for Reconfigurable Hardware

We present a garbage collector synthesized directly to hardware, capable of collecting a heap of uniform objects completely concurrently. These heaps are composed...

From Communications of the ACM

Technical Perspective: Centip3De Demonstrates More than Moore...

Exponentially increasing transistor integration also demands more interconnections, which have started hitting fundamental limits. The Centip3De design demonstrates...

Centip3De
From Communications of the ACM

Centip3De: A Many-Core Prototype Exploring 3D Integration and Near-Threshold Computing

This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between...

From Communications of the ACM

Technical Perspective: For Better or Worse, Benchmarks Shape a Field

Like other IT fields, computer architects initially reported incomparable results. We quickly saw the folly of this approach. We then went through a sequence...

Looking Back and Looking Forward
From Communications of the ACM

Looking Back and Looking Forward: Power, Performance, and Upheaval

The past 10 years have delivered two significant revolutions. Microprocessor design has been transformed — leading to multicore processors. And an entirely new...

Exact Matrix Completion via Convex Optimization
From Communications of the ACM

Exact Matrix Completion via Convex Optimization

Suppose that one observes an incomplete subset of entries selected from a low-rank matrix. When is it possible to complete the matrix and recover the entries that...

From Communications of the ACM

Technical Perspective: Reconstructing the Unknown, Balancing Structure and Uncertainty

The problem of estimating or reconstructing an unknown structured object from incomplete, partial, noisy measurements is a fundamental one in scientific and technological...

Understanding Sources of Ineffciency in General-Purpose Chips
From Communications of the ACM

Understanding Sources of Ineffciency in General-Purpose Chips

To better understand what improvement in processor efficiency is possible, we quantify the performance and energy overheads of a 720p HD H.264 encoder running on...

From Communications of the ACM

Technical Perspective: Skintroducing the Future

Two critical goals for mobile devices seem intrinsically in conflict. For carrying, the smaller the better. Yet for...

Skinput
From Communications of the ACM

Skinput: Appropriating the Skin as an Interactive Canvas

Skinput is a technology that appropriates the skin as an input surface by analyzing mechanical vibrations that propagate through the body. Specifically, we resolve...

DRAM Errors in the Wild
From Communications of the ACM

DRAM Errors in the Wild: A Large-Scale Field Study

While a large body of work exists on DRAM in lab conditions, little has been reported on real DRAM failures in large production clusters. In this paper, we analyze...

From Communications of the ACM

Technical Perspective: DRAM Errors in the Wild

In order to advance the field, knowledge of the types of memory errors at the system level, their frequencies, and conditions that...
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