acm-header
Sign In

Communications of the ACM

News


Latest News News Archive Refine your search:
datePast Month
subjectHardware
authorReuters
bg-corner

An edited collection of advanced computing news from Communications of the ACM, ACM TechNews, other ACM resources, and news sites around the Web.


Siemens Automates Design Process for Testing Chips with Advanced Packaging
From ACM TechNews

Siemens Automates Design Process for Testing Chips with Advanced Packaging

Siemens Digital Industries Software's new software system automates the design process for testing chips with several layers of silicon tiles.
Sign In for Full Access
» Forgot Password? » Create an ACM Web Account