Purdue University researchers have developed an advanced cooling technology that can handle about 10 times the heat generated by conventional computer chips. The technology consists of a miniature, lightweight device made of tiny copper spheres and carbon nanotubes that passively wick a coolant toward hot electronics, says Purdue professor Suresh V. Garimella.
This diagram depicts a cooling device called a heatpipe, used in electronics and computers. Researchersare developing an advanced type of heat pipe forhigh-power electonics in military and automotiveapplications.Credit: School of Mechanical Engineering, Purdue University
The system works by circulating water through a boiling, evaporating, and condensing process. Allowing a liquid to boil significantly increases how much heat can be removed compared with heating a liquid to temperatures below its boiling point.
From Purdue University News
View Full Article
Abstracts Copyright © 2010 Information Inc., Bethesda, Maryland, USA
No entries found