Purdue University is using funding from the Semiconductor Research Corp. and the U.S. National Institute of Standards and Technology for its NEW LIMITS facility, which is designed to address the challenges of critical parts for low-power, high-performance computer chips in consumer electronics, vehicles, and national security.
The center aims to enhance new materials for logic, memory, and interconnects to make computers faster and more power-efficient.
"We won't be able to deliver a new chip to the industry, but we will provide viable solutions for these three major components," says Purdue professor Zhihong Chen.
He notes the center will prioritize interconnect redesign, using ultra-thin two-dimensional materials with a thickness of only a few atoms to improve silicon transistor and copper interconnect performance while also maintaining a smaller size.
As NEW LIMITS tackles interconnect and logic, the researchers also plan to consolidate data storage and retrieval into a new type of memory cell.
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