The Hybrid Memory Cube Consortium (HMC), which aims to replace standard DDR3 memory modules found in conventional computers, has proposed a faster and more power-efficient specification, called Gen2, for its emerging Hybrid Memory Cube memory technology.
The HMC Gen2 specification doubles the throughput of the previous specification, which could deliver 15 times the bandwidth of a standard DDR3 module, while consuming 70 percent less energy, according to the consortium. The new specification also could accelerate calculations in supercomputers, improve in-memory computing for databases and other applications, and aid in providing faster response times to Web requests.
HMC's development was led by Samsung and Micron Technology, and Microsoft, Xilinx, Altera, and ARM also are members of the consortium.
"System designers are looking for access to very high memory bandwidth [and Gen2] allows them to get access to memory bandwidth with fewer pins," says Micron's Mike Black. He says HMC also could be used in the networking sector in systems that need more memory to buffer high-volume traffic.
From IDG News Service
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