IBM Research is working on "interlayer cooling," in which water is pumped through tiny tubes penetrating chips are piggypacked using high-speed communication technology called through-silicon vias. IBM's approach is designed to deal with overheating problems that otherwise severely limit chip stacking. The protruding pipe fittings are for connecting water-cooling tubes.
Credit: Stephen Shankland/CNET
Despite a strong philosophical connection, computers and brains inhabit separate realms in research.
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