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Communications of the ACM

Research Archive


Archives

The Research archive provides access to all Research articles published in past issues of Communications of the ACM.

January 2014


From Communications of the ACM

Technical Perspective: Silicon Stress

Moore's Law has been the mainstay of semiconductor electronics since the invention of the transistor and its application to the integrated circuit. Implicit in this evolution is the assumption that we can print these circuits…


From Communications of the ACM

TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3D IC

TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3D IC

Three-dimensional integrated circuit (3D IC) with through-silicon-via (TSV) is believed to offer new levels of efficiency, power, performance, and form-factor advantages over the conventional 2D IC.

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